Methods for fabricating magnetic transducers using post-deposition tilting

ABSTRACT

In one general embodiment, a method is provided for fabricating magnetic structures using post-deposition tilting. A thin film magnetic transducer structure is formed on a substantially planar portion of a substrate such that a plane of deposition of the thin film transducer structure is substantially parallel to a plane of the substrate. Additionally, the thin film transducer structure is caused to tilt at an angle relative to the plane of the substrate. The thin film transducer is fixed at the angle after being tilted.

RELATED APPLICATIONS

This application is a continuation of U.S. patent Ser. No. 12/547,224,filed Aug. 25, 2009, which is herein incorporated by reference.

BACKGROUND

The present invention relates to thin film processing, and moreparticularly, this invention relates to methods for fabricating magneticstructures using post-deposition tilting.

In magnetic storage systems, data is read from and written onto magneticrecording media utilizing magnetic transducers commonly. Data is writtenon the magnetic recording media by moving a magnetic recordingtransducer to a position over the media where the data is to be stored.The magnetic recording transducer then generates a magnetic field, whichencodes the data into the magnetic media. Data is read from the media bysimilarly positioning the magnetic read transducer and then sensing themagnetic field of the magnetic media. Read and write operations may beindependently synchronized with the movement of the media to ensure thatthe data can be read from and written to the desired location on themedia.

BRIEF SUMMARY

In one general embodiment, a method is provided for fabricating magnetictransducers using post-deposition tilting. A thin film magnetictransducer structure is formed on a substantially planar portion of asubstrate such that a plane of deposition of the thin film transducerstructure is substantially parallel to a plane of the substrate.Additionally, the thin film transducer structure is caused to tilt at anangle relative to the plane of the substrate. The thin film transduceris fixed at the angle after being tilted.

In another general embodiment, a method is provided for fabricatingmagnetic transducers using post-deposition tilting. A thin film magnetictransducer structure is formed on a substantially planar portion of asubstrate such that a plane of deposition of the thin film transducerstructure is substantially parallel to a plane of the substrate.Additionally, a sacrificial portion of the substrate is removed forcausing the thin film transducer structure to tilt at an angle relativeto the plane of the substrate.

In yet another general embodiment, a method is provided for fabricatingtransducers using post-deposition tilting. A magnetic transducer isformed on a substantially planar potion of a substrate such that a planeof deposition of the magnetic transducer is substantially parallel to aplane of the substrate. The magnetic transducer is caused to tilt at apredetermined angle relative to the plane of the substrate.

Other aspects and advantages of the present invention will becomeapparent from the following detailed description, which, when taken inconjunction with the drawings, illustrate by way of example theprinciples of the invention.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

For a fuller understanding of the nature and advantages of the presentinvention, as well as the preferred mode of use, reference should bemade to the following detailed description read in conjunction with theaccompanying drawings.

FIG. 1 is a schematic diagram of a simplified tape drive systemaccording to one embodiment.

FIG. 2 shows a method for fabricating magnetic transducers usingpost-deposition tilting, in accordance with one embodiment.

FIG. 3 shows a method for fabricating a magnetic transducer usingpost-deposition tilting, in accordance with another embodiment.

FIG. 4 shows a method for fabricating a magnetic transducer usingpost-deposition tilting, in accordance with still another embodiment.

FIG. 5 shows a method for fabricating a magnetic transducer usingpost-deposition tilting, in accordance with yet another embodiment.

DETAILED DESCRIPTION

The following description is made for the purpose of illustrating thegeneral principles of the present invention and is not meant to limitthe inventive concepts claimed herein. Further, particular featuresdescribed herein can be used in combination with other describedfeatures in each of the various possible combinations and permutations.

Unless otherwise specifically defined herein, all terms are to be giventheir broadest possible interpretation including meanings implied fromthe specification as well as meanings understood by those skilled in theart and/or as defined in dictionaries, treatises, etc.

The following description discloses several preferred embodiments ofmagnetic systems, as well as operation and/or component parts thereof.

In one general embodiment, a method is provided for fabricating magnetictransducers using post-deposition tilting. A thin film magnetictransducer structure is formed on a substantially planar portion of asubstrate such that a plane of deposition of the thin film transducerstructure is substantially parallel to a plane of the substrate.Additionally, the thin film transducer structure is caused to tilt at anangle relative to the plane of the substrate. Furthermore, after causingthe thin film transducer structure to tilt, the thin film transducerstructure may optionally be fixed in place on the substrate at theangle.

In another general embodiment, a method is provided for fabricatingmagnetic transducers using post-deposition tilting. A thin film magnetictransducer structure is formed on a substantially planar portion of asubstrate such that a plane of deposition of the thin film transducerstructure is substantially parallel to a plane of the substrate.Additionally, a sacrificial portion of the substrate is removed forcausing the thin film transducer structure to flit at an angle relativeto the plane of the substrate.

In yet another general embodiment, a method is provided for fabricatingmagnetic transducers using post-deposition tilting. A magnetictransducer is formed on a substantially planar potion of a substratesuch that a plane of deposition of the magnetic transducer issubstantially parallel to a plane of the substrate. The magnetictransducer is caused to tilt at a predetermined angle relative to theplane of the substrate.

In one general embodiment, tilting is achieved by patterning andreleasing a MEMS structure. The structure is attached to the substrateby two arms which allow the transducer to rotate.

In another general embodiment, a slope is created in the substrate belowthe transducer and the transducer is tilted onto this slope. In thisembodiment, capillary action may be used to apply the force which tiltsthe transducer onto this slope.

In yet another general embodiment, a cantilever is created by removing asacrificial layer placed below the transducer during its fabrication. Inthis embodiment, tilting can be achieved by incorporating a stressesinto the layers that later become the cantilever. As the cantilever isreleased, these stresses act to bend the cantilever and tilt thetransducer.

FIG. 1 illustrates a simplified tape drive 100 of a tape-based datastorage system, which may be employed in the context of the presentinvention. While one specific implementation of a tape drive is shown inFIG. 1, it should be noted that the embodiments described herein may beimplemented in the context of any type of magnetic recording system.

As shown, a tape supply cartridge 120 and a take-up reel 121 areprovided to support a tape 122. One or more of the reels may form partof a removable cassette and are not necessarily part of the system 100.The tape drive, such as that illustrated in FIG. 1, may further includedrive motor(s) to drive the tape supply cartridge 120 and the take-upreel 121 to move the tape 122 over a tape head 126 of any type.

Guides 125 guide the tape 122 across the tape head 126. Such tape head126 is in turn coupled to a controller assembly 128 via a cable 130. Thecontroller 128 typically controls head functions such as servofollowing, writing, reading, etc. The cable 130 may include read/writecircuits to transmit data to the head 126 to be recorded on the tape 122and to receive data read by the head 126 from the tape 122. An actuator132 controls position of the head 126 relative to the tape 122.

An interface may also be provided for communication between the tapedrive and a host (integral or external) to send and receive the data andfor controlling the operation of the tape drive and communicating thestatus of the tape drive to the host, all as will be understood by thoseof skill in the art.

FIG. 2 shows a method 400 for fabricating magnetic transducers usingpost-deposition tilting, in accordance with one embodiment. As anoption, the present method 400 may be implemented to constructstructures to be used for the read write transducer in tape drives suchas the one shown in FIG. 1. Of course, however, this method 400 andothers presented herein may be used to form magnetic structures for awide variety of devices and/or purposes which may or may not be relatedto magnetic recording. Further, the methods presented herein may becarried out in any desired environment. It should also be noted that theaforementioned definitions may apply during the present description.

As shown, a thin film magnetic transducer structure is formed on asubstantially planar portion of a substrate such that a plane ofdeposition of the thin film transducer structure is substantiallyparallel to a plane of the substrate. See operation 402. Note thattypically, a transducer will include multiple thin film layers, whichmay include one or more magnetic layers. It should also be noted thatthe thin film transducer structure may be formed using any conventionalprocesses that are well known to those skilled in the art. Moreover, thethin film transducer structure may be of any conventional or futureconstruction.

As an option, the thin film transducer structure may be a magneticsensor (reader). As another option, the thin film transducer structuremay be a magnetic writer. Furthermore, the substrate may be formed ofany acceptable material. For example, in one embodiment, the substratemay be comprised of silicon.

As shown further, the thin film transducer structure is caused to tiltat an angle relative to the plane of the substrate. See operation 404.For example, in a writer, the angle of the plane of deposition of thewrite gap, with respect to the plane of the substrate, will generallychange with the tilting to somewhere from greater than 0 degrees up to90 degrees, e.g., from about 10 to about 90 degrees, from about 45 toabout 90 degrees, from about 30 degrees to about 60 degrees, etc.

Causing the thin film transducer structure to tilt may be accomplishedusing a variety of techniques. For example, in one embodiment, capillaryaction may operatively cause the thin film transducer structure to tiltat the angle. In another embodiment, removing a sacrificial portion ofthe substrate may cause another portion of the substrate to form acantilever supporting the thin film transducer structure, and a localstress may operatively cause the cantilever to bend, thereby causing thethin film transducer structure to tilt at the angle. In still anotherembodiment, removing the portion of the substrate may allow built-instresses to cause the thin film transducer structure to tilt at theangle. In still another embodiment an external force may be applied totilt the sensor, for example using a magnetic field.

As an option, an axis of the tilting is about parallel to the plane ofthe substrate. As another option, an axis of the tilting may be aboutparallel to the plane of the substrate and about perpendicular to anexpected direction of media travel relative to the magnetic sensor.

After causing the thin film transducer structure to tilt, the thin filmtransducer structure is preferably fixed in place on the substrate atthe angle. See optional operation 406. In some approaches, operation 406may be omitted. For example, the tilted thin film transducer structuremay tilt such that the thin film transducer structure need not be fixedin place. This my occur for example, if film stresses cause a cantileverto be pushed against a stop with enough force to prevent furthermovement. More detail about how the tilt angle is controlled ispresented below.

In further approaches, the tilted structure may be self-fixing, e.g., bya pre-applied adhesive, by naturally-occurring attractive forces with anunderlying layer, etc.

In yet other approaches, a protective layer may be added to the tiltedstructure, which may have the effect of fixing the tilted structure inplace.

It should be noted that the thin film transducer structure may be tiltedat any desirable angle depending on a particular application and/orsystem. For example, in one embodiment, the thin film transducerstructure may be tilted such that the plane of deposition thereof isoriented at an angle of greater than about 1 degree from the plane ofthe substrate, where the plane of the substrate is typically parallel tothe flat upper surface of the substrate upon which the various layersare deposited. In various other embodiments, the thin film transducerstructure may be tilted such that the plane of deposition thereof isoriented at an angle of greater than about 2 degrees, greater than about5 degrees, greater than about 15 degrees, greater than about 30 degrees,greater than about 45 degrees, greater than about 60 degrees, greaterthan about 80 degrees, etc.

As an option, the method 400 may further include planarizing the thinfilm transducer structure along a plane substantially parallel to theplane of the substrate. See operation 408. This planarization may definethe media-facing surface of the thin film structure. In one embodiment,the thin film transducer structure may be formed on a rigid platformthat tilts with the thin film transducer structure. In this case, therigid platform may be utilized to reduce exertion of stresses on thethin film transducer structure. Strictly as an option, the substrate mayinclude the platform.

In various other embodiments, the substrate may include any other itemor component under the thin film transducer structure. In oneembodiment, the method 400 may further include removing a sacrificialportion of the substrate for creating a pivot point about which the thinfilm transducer structure pivots.

While the pivot point may be centered relative to the thin filmtransducer structure, in a particularly preferred approach, the pivotpoint is under and off-center from the thin film transducer structure.As another option, the pivot point may be spaced apart from the thinfilth transducer structure such that the thin film transducer structurepivots along an arc.

More illustrative information will now be set forth regarding variousoptional architectures and features with which the foregoing frameworkmay or may not be implemented, per the desires of the user. It should bestrongly noted that the following information is set forth forillustrative purposes and should not be construed as limiting in anymanner. Any of the following features may be optionally incorporatedwith or without the exclusion of other features described.

FIG. 3 shows a method 500 for fabricating a magnetic transducer usingpost-deposition tilting, in accordance with another embodiment. FIGS. 3a-f show the side view (cut though the wafer) at various stages of thefabrication process. FIG. 3 g shows a top view of the structure justbefore releasing and tilting, corresponding to FIG. 3 b. As shown,Microelectromechanical structures (MEMS) are used to rotate a magnetictransducer, in this example a sensor 502. First, a sensor 502 isdeposited onto a silicon on insulator (SOI) wafer 504 as shown in FIG. 3a. Next, the wafer 504 is patterned such that the sensor 502 may rotateabout the pivot point 506 when released (FIG. 3 b). This pivot point 506denotes the center of rotation of the structure.

Once released (FIG. 3 c), the sensor 502 is rotated about the pivotpoint 506 (FIG. 5 d) and material is applied thereto to lock it in place(FIG. 3 e). Any suitable method for rotation may be employed. In oneembodiment, rotating a structure including the sensor 502 may beaccomplished by providing an external macroscopic field to exert a forceon the magnetic material in the sensor 502. In another embodiment, therotation may be accomplished by incorporating built in stresses in theMEMS structure to produce a structure that will rotate once released. Ina further embodiment, the sensor 502 may be mechanically rotated.

The structure may also contain mechanisms to control the angle of thesensor during the tilting process. With continued reference to FIG. 3 d,it is seen that the platform 516 upon which the sensor 502 is formedabuts the bottom 518 of the channel formed by removing the SiO₂. Thishas the effect of defining the degree of rotation of the sensor.Accordingly, the tilt angle of the sensor 502 can be carefully andreproducibly controlled by selecting the appropriate pivot pointposition, platform dimensions and/or channel depth.

Additionally, as shown in FIG. 3 e, the sensor 502 may be fixed intoplace by adding a material 508 to the magnetic transducer. Such materialmay include any material capable of fixing the sensor 502. Illustrativematerials include spin on coatings (e.g., polymers), vapor-depositedmaterials, etc. In the final step, the wafer is polished to adjust theheight of the magnetic transducer (FIG. 3 f). In various embodiments,such polishing may include chemical mechanical polishing (CMP), reactiveion etching (RIE), and/or any other various polishing techniques.

FIG. 3 g shows a top-down view of a magnetic transducer duringfabrication using method 500. As shown, arms 512 are provided such thatthe sensor 502 may be rotated about the pivot point. Additionally asshown, leads 514 may be routed using a path defined by the arms 512.

Note that the arms 512 need not be straight as shown in FIG. 3 g, butrather may take any desired shape or be any structure that will providethe required rotation. For instance, one or more of the arms may followa tortuous path that provides the required stiffness and rotation point.Any suitable MEMS structures which provide rotation that are known tothose skilled in the art may be used.

FIG. 4 shows a method 600 for fabricating a magnetic transducer usingpost-deposition tilting, in accordance with still another embodiment. Asshown, a cavity 602 is etched into a wafer 604 (FIG. 4 a) and thenfilled with a temporary filling material 606 (FIG. 4 b). A structuresuch as a sensor 608 is then deposited onto a membrane layer 610 (FIG. 4c). Such layer 610 may include any layer such as a nitride layer, apolymer layer, etc. Additionally, connecting lines 612 (e.g. leads) maybe deposited.

Next, the temporary filling material 606 is removed (FIG. 4 d) to form acavity 614 under the membrane layer 610 and creates a suspended membraneabove a tilted surface 616. In one embodiment, the magnetic transducermay be dipped in a liquid such as water and, upon removal and drying,the capillary force will pull down the membrane layer 610. The membranelayer 610 then adheres to the cavity surface, creating a sensor with atilt (FIG. 4 e). Next, the cavity is filled in (FIG. 41) with a fillingmaterial 618, e.g., alumina, polymer, etc., and polished to create auniform surface (FIG. 4 g). Connections to the sensor 608 may be placedat the bottom of the sensor 608 and accessed through the back of thewafer 604, or by bringing electrical traces to the waver edge viagrooves in the substrate. This method has the additional advantage thatthe tilting and finishing process adds little additional stress to thesensor.

FIG. 5 shows a method 700 for fabricating a magnetic transducer usingpost-deposition tilting, in accordance with yet another embodiment. Asshown, a locally stressed cantilever is utilized at the bending regionto tilt a structure such as a sensor 702 out of a wafer plane. A film704 (e.g. a nitride, a polymer, etc.) is deposited onto a wafer 706 withselected areas of a sacrificial layer 708. The film 704 is patternedinto a cantilever.

The film 704 is locally stressed, using a suitable method such as abimoiph structure 710. The magnetic sensor 702 and leads 712 are thendeposited onto the film 704 (FIG. 5 a). Additionally, a conductor 718may optionally be placed on the wafer 706. Next, the sacrificial layer708 is removed, releasing the locally stressed cantilever, which bendsupward (FIG. 5 b). The area 714 surrounding the cantilever is thenfilled in, possibly by a plating metal 716 onto the conductor 718 (FIG.5 c), or other filling material such as polymer. Finally, the structureis filled and polished to make a uniform surface (FIG. 5 d).

It should be noted that, while FIGS. 5-7 have been described to includemagnetic sensors, magnetic readers or any other transducer such asmagnetic writers may also or alternatively be present in the thin filmtransducer structure. Additionally, any suitable material may beutilized as filling material, wafer material, membrane layers, and anyother component material described for exemplary purposes. Further, itshould be noted that the methods for developing planar heads asdescribed above offer the possibility of fabrication of 2D arrays ofelements, elimination of a row bar lapping step, finishing at the waferlevel, and wafer level deposition of overcoats onto a mechanicalsurface. Any of these advantages allow development of a simpler andlower cost magnetic head, while providing more design freedom.

The foregoing teachings provide a way to fabricate planar recordingheads. Moreover, the foregoing methodology allows one to fabricatematrix arrays of write and/or read transducers.

In addition, the planar head design may allow the use of silicon as asubstrate. This allows the integration of electronics including writedrivers or read preamplifiers on the wafer. In addition, siliconprocessing may provide yet another reduction in cost:

Furthermore, the tilted structures described above may allow the sensorto be deposited using a standard process. Also, the magnetic sensor maybe tested before it is tilted. Additionally, as mentioned above, a largerange of tilt angles relative to the initial plane of deposition arepossible, including tilting the sensor to greater than about 10 degrees,greater than about 30 degrees, greater than about 45 degrees, greaterthan about 60 degrees, greater than about 80 degrees, and about 90degrees.

While various embodiments have been described above, it should beunderstood that they have been presented by way of example only, and notlimitation. Thus, the breadth and scope of a preferred embodiment shouldnot be limited by any of the above-described exemplary embodiments, butshould be defined only in accordance with the following claims and theirequivalents.

1. A method, comprising: forming a thin film magnetic transducerstructure on a substantially planar portion of a substrate such that aplane of deposition of the thin film magnetic transducer structure issubstantially parallel to a plane of the substrate; and causing the thinfilm transducer structure to tilt at an angle relative to the plane ofthe substrate, wherein the thin film magnetic transducer structure isfixed at the angle after being tilted.
 2. The method as recited in claim1, wherein the thin film magnetic transducer structure is tilted suchthat the plane of deposition thereof is oriented at an angle of greaterthan about 1 degree from the plane of the substrate.
 3. The method asrecited in claim 1, wherein the substrate comprises silicon.
 4. Themethod as recited in claim 1, further comprising planarizing the thinfilm magnetic transducer structure along a plane substantially parallelto the plane of the substrate.
 5. The method as recited in claim 1,wherein the thin film magnetic transducer structure is formed on a rigidplatform that tilts with the thin film magnetic transducer structure. 6.The method as recited in claim 1, wherein an axis of the tilting isabout parallel to the plane of the substrate.
 7. The method as recitedin claim 1, wherein the thin film magnetic transducer structure is amagnetic sensor.
 8. The method as recited in claim 1, wherein the thinfilm magnetic transducer structure is a magnetic writer.
 9. The methodas recited in claim 1, further comprising removing a sacrificial portionof the substrate for causing the thin film magnetic transducer structureto pivot.
 10. The method as recited in claim 9, wherein a point ofpivoting of the thin film magnetic transducer structure is under andoff-center from the thin film magnetic transducer structure.
 12. Themethod as recited in claim 9, wherein removing the sacrificial portionof the substrate causes another portion of the substrate to form acantilever supporting the thin film magnetic transducer structure,wherein a local stress operatively causes the cantilever to bend,thereby causing the thin film magnetic transducer structure to tilt atthe angle.
 13. The method as recited in claim 9, wherein removing theportion of the substrate allows built-in stresses to cause the thin filmmagnetic transducer structure to tilt at the angle.
 11. The method asrecited in claim 1, and further comprising fixing the thin film magnetictransducer structure in place on the substrate at the angle aftercausing the thin film magnetic transducer structure to tilt.
 14. Themethod as recited in claim 1, wherein capillary action operativelycauses the thin film magnetic transducer structure to tilt at the angle.15. A method, comprising forming a magnetic transducer on asubstantially planar potion of a substrate such that a plane ofdeposition of the magnetic transducer is substantially parallel to aplane of the substrate; causing the magnetic transducer to tilt at apredetermined angle relative to the plane of the substrate.
 16. Themethod as recited in claim 15, wherein an axis of the tilting is aboutparallel to the plane of the substrate and about perpendicular to anexpected direction of media travel relative to the magnetic transducer.17. The method as recited in claim 15, further comprising testing themagnetic transducer before causing the magnetic transducer to tilt. 18.The method as recited in claim 15, further comprising, after causing themagnetic transducer structure to tilt, fixing the magnetic transducerstructure in place at the angle.
 19. The method as recited in claim 15,wherein the magnetic transducer structure is a magnetic sensor.
 20. Themethod as recited in claim 15, wherein the magnetic transducer structureis caused to tilt by removing a sacrificial portion of the substrate.